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ASE Receives Sub-contracting Supplier of the Year Award from Tower Semiconductor

Company awarded in recognition of excellent support and commitment

Santa Clara, California, November 25, 2002 - Advanced Semiconductor Engineering, Inc. (NYSE: ASX), one of the world's largest semiconductor packaging and testing companies, today announced that it has received the Sub-contracting Supplier of the Year Award from Tower Semiconductor (NASDAQ: TSEM, TASE: TSEM). ASE provides assembly and testing services for Tower Semiconductor's advanced flash memory and CMOS image sensor IC chips.

In 1997, Tower Semiconductor established the Supplier Management Program, "Sharing a Common Goal" to provide a dialogue between Tower and its key suppliers. The Sub-contracting Supplier Award is derived from this program and recognizes supplier performance based on a stringent scoring system in the categories for service, delivery, technology and systems, and cost.

 
"Ultimately, the Supplier Management Program focuses on maintaining long term partnerships with suppliers, benefiting Tower's customers through consistent equipment and service quality," said Ron Niv, Fab 2 Manager in Tower Semiconductor, Inc. "We look forward to maintaining the high standards set between Tower and ASE for test and assembly."
 
"ASE is highly focused on customer satisfaction and recognizes that the key to achieving it goes beyond providing essential technologies and quality products. We also understand that each customer is unique in their requirements and we will go the extra mile to fulfill these individual needs," said Dr. Tien Wu, President of ASE Americas and Europe. "ASE is honored to receive the Tower Supplier Award, and we will work diligently for continuous improvement in order to contribute to the success of Tower and ASE."
 
About Advanced Semiconductor Engineering Group (ASE Group)
The ASE Group is one of the world's largest providers of semiconductor manufacturing services. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performing chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co Ltd, a member of the ASE Group. The Group generated sales revenues of $2.17 billion in 2001 and employs 23,000 people worldwide. For more information about the ASE Group, visit http://www.aseglobal.com
 
 
About Tower Semiconductor

Tower Semiconductor Ltd. is a pure-play independent wafer foundry established in 1993. The company manufactures integrated circuits with geometries ranging from 1.0 to 0.18 microns; it also provides complementary manufacturing services and design support. In addition to digital CMOS process technology, Tower offers advanced non-volatile memory solutions, mixed-signal and CMOS image-sensor technologies. To provide world-class customer service, the company maintains two manufacturing facilities: Fab 1 has process technologies from 1.0 to 0.35 microns and can produce up to 20,000 150mm wafers per month. Fab 2 features 0.18-micron and below process technologies, including foundry-standard technology, and will offer full production capacity of 33,000 200mm wafers per month. The Tower Web site is located at www.towersemi.com

 
 
Contact Information

Clementine Chen / Freda Wan Jennifer Yuen
ASE Asia Pacific
+886-2-8780 5489
clementine_chen@aseglobal.com
freda_wan@aseglobal.com
ASE Americas/Europe
+1-408-986 6519
jennifer_yuen@aseus.com