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ASE Receives ISO 26262 Certification Standard Related to the Safety of Electrical and Electronic Systems within a Car

Key enabler for ASE to support the highly demanding safety and functional standards required in automotive device manufacturing

Taipei, Taiwan, October 06, 2016 - Advanced Semiconductor Engineering, Inc (ASE, TAIEX: 2311, NYSE: ASX), the leading provider of semiconductor assembly and test services, today announced that its Chung Li, Taiwan facility has received the ISO 26262 certification from TÜV NORD, a technical service provider that helps companies to validate the safety of products and services. ISO 26262 is a standard related to the safety of electrical and electronic systems within a car and addresses possible hazards caused by malfunctioning behavior of safety-related systems, including interaction of these systems.

"The increasing number of electronic functions in an automotive vehicle has added to the complexity in automotive manufacturing. Such complexity also adds to the increased need for the IC assembly manufacturing process to adhere to strict automotive benchmarks and practices in order to achieve zero ppm in automotive testing. Zero ppm creates a mindset that strives to guarantee quality and reliability to ensure that vehicles are safe and dependable," says TS Chen, President of ASE Chung Li. "ASE has invested time, financial and human resources to train its engineers to identify and manage risks within the manufacturing process and to avoid these risks by providing appropriate requirements and processes as outlined in the ISO 26262 standards," he continued.

The ASE Chung Li site has been in the forefront of automotive IC assembly and testing, providing many of the industry’s top tier automotive device players with packaging solutions for almost two decades. The facility is also TS 16949 certified and continues to improve its quality and safety standards by undertaking global certification programs. The ISO 26262 certification will greatly benefit customers and ASE as both parties would be able to shorten the time needed to verify the functional safety of all products and enable customers to reach their intended markets quickly.

Heterogeneous integrated package solutions such as ASE’s System-in-Package, MEMS and sensor module solutions are robust technologies developed for the myriad and sophisticated electronics that make automotive vehicles smarter and safer. In an industry that innovates non-stop, ASE is poised to grow its IC packaging portfolio and technology capability as well as the adoption of international safety and quality standards for the future in connected and autonomous cars.



About ASE Group


The ASE Group is among the leading providers of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co., Ltd. and its subsidiaries, members of the ASE Group. For more information about the ASE Group, visit www.aseglobal.com.