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    Plastic dual-in-line packaging (PDIP) is a principal package using the pin-through-hole (PTH) technology. It is widely used in low cost and manual applications. ASE offers PDIP with lead counts ranging from 8 to 64 leads and package width from 7.62mm (300mil) to 17.78mm (700mil). For package size reduction, ASE offers two alternatives - the narrow body type, Skinny PDIP (width is 300mil, lead count is 24, 28) and the narrow lead pitch type, Shrink PDIP or SDIP (lead pitch is 1.78mm or 70mil, lead count is 32, 56, 64).


    Dual-in-line packages are considered one of the more established industry standard packages. PDIP’s broad ranges of applications include logic, memory ICs, microcontrollers, and logic, power ICs used in automotive devices, consumer and communications products.


    300mil Body Width: 8, 14, 16, 18, 20, 24, 28 available lead count
    400mil Body Width: 32 available lead count
    600mil Body Width: 24, 28, 32, 40, 42, 48, 56 available lead count
    700mil Body Width: 64 available lead count
    JEDEC standard compliant
    Wide choice of pad sizes to meet die size per customer’s lead frame design capability
    Pb-free process ready and available


    Package Level
    Test Item Reference Standard Condition/Duration
    MSL JEDEC 22-A103 Level 3, 30ºC/60% RH, 192 hrs
    TCT JEDEC 22-A104-B -65ºC to 150ºC, 500/1000 cycles
    HAST JEDEC 22-A118 130ºC/85% RH, 33.5 PSI 48/96 hrs
    HTST JEDEC 22-A103-B 150ºC, 500/1000 hrs
    THT JEDEC 22-A101-B 85ºC/85%RH 500/1000 hrs
    PCT JEDEC 22-A102 121ºC/100%RH/15 psi ,96/168 hours
    Thermal shock test JEDEC JESD22-A106 -65ºC~150ºC, 100 / 300 / 500 cycles