• English
  • Products
  • Overview

    TSOP(I) and TSOP(II) are thin profile small outline packages with an overall thickness of as thin as 1.1mm (cf. 2.6~2.8mm for SOP of the same I/O). TSOP(I) and TSOP(II) differ in the location of leads. TSOP(II) lines its leads on the narrow side, while TSOP(II) lines up its leads on the wide side.


    Due to its thin profile, TSOP is suitable for applications in portable electronic products, cell phones, and memory modules.
    Telecommunication Products
    Cellular Phone Wireless LAN
    Portable Products

    Personal Digital Assistants Digital Camera Audio/Video
    Low Pin Count Packages

    Information Appliances


    Low profiles and lightweight
    Steady yield
    Low cost
    Pb-free Process ready and available
    TSOP(I) body size from 11.8x8 up to 18.4x12mils
    TSOP(II) body size from 17.1x7.6 up to 22.2x10.2mils
    TSOP(I) lead counts available 28/32/40/48
    TSOP(II) lead counts available 20/24/40/44/50/54
    JEDEC standard outlines
    Existing BOM and process flow


    Package Level
    Test Item Reference Standard Condition/Duration
    MSL JEDEC 22-A103 Level 3, 30°C/60% RH, 192 hrs
    TCT JEDEC 22-A104-B -65°C to 150°C, 100/300/500/1000 cycles
    HAST JEDEC 22-A118 130°C/85% RH, 33.5 PSI 48/96 hrs
    HTST JEDEC 22-A103-B 150°C, 500/1000 hrs
    THT JEDEC 22-A101-B 85°C/85%RH 500/1000 hrs
    PCT JEDEC 22-A102 121°C/100%RH/15 psi ,96/168 hours
    Board Level  (Contact ASE for further details.)