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  • Overview

    Small Outline J-leaded (SOJ) package is similar to PDIP, but the leads' end are formed in a "J"-shape to be folded under the body. This aims to reduce the foot print. With the increasing popularity of SMT and with a smaller outline than PDIP, SOJ is widely used to complement PDIP.

    Application

    Telecommunication Products
    Cellular Phone
    Wireless LAN

    Portable Products
    Personal Digital Assistants
    Digital Camera
    Audio/Video

    Low Pin Count Packages
    Information Appliances

    Features

    Low profiles and lightweight
    Steady yield
    Low cost
    SOJ body sizes from 710 up to 1125 mils
    Pb-free Process ready and available
    JEDEC standard outlines
    Existing BOM and process flow

    Reliability

    Package Level
    Test Item Reference Standard Condition/Duration
    MSL JEDEC 22-A103 Level 3, 30°C/60% RH, 192 hrs
    TCT JEDEC 22-A104-B -65°C to 150°C, 100/30/500/1000 cycles
    HAST JEDEC 22-A118 130°C/85% RH, 33.5 PSI 48/96 hrs
    HTST JEDEC 22-A103-B 150°C, 500/1000 hrs
    THT JEDEC 22-A101-B 85°C/85%RH 500/1000 hrs
    PCT JEDEC 22-A102 121°C/100%RH/15 psi, 96/168 hours
    Thermal shock test JEDEC JESD22-A106 -65°C~150°C, 100/300/500 cycles
    Board Level  (Contact ASE for further details.)