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    Small Outline J-leaded (SOJ) package is similar to PDIP, but the leads' end are formed in a "J"-shape to be folded under the body. This aims to reduce the foot print. With the increasing popularity of SMT and with a smaller outline than PDIP, SOJ is widely used to complement PDIP.


    Telecommunication Products
    Cellular Phone
    Wireless LAN

    Portable Products
    Personal Digital Assistants
    Digital Camera

    Low Pin Count Packages
    Information Appliances


    Low profiles and lightweight
    Steady yield
    Low cost
    SOJ body sizes from 710 up to 1125 mils
    Pb-free Process ready and available
    JEDEC standard outlines
    Existing BOM and process flow


    Package Level
    Test Item Reference Standard Condition/Duration
    MSL JEDEC 22-A103 Level 3, 30°C/60% RH, 192 hrs
    TCT JEDEC 22-A104-B -65°C to 150°C, 100/30/500/1000 cycles
    HAST JEDEC 22-A118 130°C/85% RH, 33.5 PSI 48/96 hrs
    HTST JEDEC 22-A103-B 150°C, 500/1000 hrs
    THT JEDEC 22-A101-B 85°C/85%RH 500/1000 hrs
    PCT JEDEC 22-A102 121°C/100%RH/15 psi, 96/168 hours
    Thermal shock test JEDEC JESD22-A106 -65°C~150°C, 100/300/500 cycles
    Board Level  (Contact ASE for further details.)