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  • Overview

    Discrete packages are mainly separated Through Hole Device (THD) & Surface Mounting Device (SMD) type which are molded epoxy molding compound. According to JEDEC standards, there are several kinds of mold & lead shapes.

    Applications

    ASE Discrete THD package is optimized for using power device (SMP, motor, transformer in LCD/PDP TV, PC, Audio, Automotive area) and also SMD Package is designed for small signal module (Cellular phone, MP3, Camera, potable electronic device, etc.)

    Features

    Discrete Package is suitable for high, low power and high speed switching, also several kind of solution and application area requiring High reliability & low consumption.

    Package Offering

    1. THD (Through Hole Device) Type
    TO-92 TO-126 TO-220 TO-220FP TO-247 TO-264 TO-3P
    Outline
    Dimension
    (mm)
    (L*W*H)
    19.05
    4.58
    3.86
    27.26
    8.00
    3.25
    28.78
    9.90
    4.50
    28.85
    10.16
    4.70
    41.07
    15.95
    5.03
    46.61
    19.98
    4.97
    39.90
    15.60
    4.80
    2. SMD (Surface Mounting Device) Type
    SOT-23 SOT-223 SOT-89 SOT-323 SOT-343 SOT-363 SOP-8L TO-252 TO-263
    Outline
    Dimension
    (mm)
    (L*W*H)
    19.05
    4.58
    3.86
    27.26
    8.00
    3.25
    28.78
    9.90
    4.50
    28.85
    10.16
    4.70
    41.07
    15.95
    5.03
    9.15
    6.60
    2.30
    15.30
    9.90
    4.50
    9.15
    6.60
    2.30
    15.30
    9.90
    4.50
    2.9x1.3mm to 46.61x19.88mm package
    2 lead to 3 lead counts
    Low assembly cost
    Thermal and electrical performance
    Good power dissipation
    JEDEC standard outlines
    Lead free process available
    Full In-house assembly & test capability

    Reliability

    Test Item Reference Standard Condition/Duration
    MSL JEDEC22-A103 Level 3, 30°C/60% RH, 192 hrs
    TCT JEDEC 22-A104-B -65°C to 150°C, 500, 1000 cycles
    HAST JEDEC 22-A118 130°C/85% RH, 33.5 psi 96 hrs
    HTST JEDEC 22-A103-B 150°C, 500/1000 hrs