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    Plastic Leaded Chip Carrier (PLCC) is widely used in micro-controllers and consumer electronics. Each lead of the PLCC is formed into a "J"-shape and folded under the package body. ASE provides PLCC packaging services in compliance with JEDEC standard. Lead count ranges from 20 to 84 with 1.27mm (50mil) lead pitch.


    ASE's PLCC product was designed in compliance with JEDEC standard for 'J' shape leaded SMT packages. Its robust leads and smaller foot space makes it applicable for surface mount and replaceable plug-in assembly via sockets. Design applications include memory, processors and controllers, ASIC, DSP, PC chipset device for consumer product, automotive and aerospace.


    453~1153mils body sizes
    28~84 available lead counts
    JEDEC standard compliant
    Wide selection of pad size to die size
    High conductivity lead frame
    Wide selection of pad size to meet die size per customized lead frame design capability
    Pb-free process ready and available


    Package Level
    Test Item Reference Standard Condition/Duration
    MSL JEDEC 22-A113 Level 3, 30°C/60% RH, 192 hrs
    TCT JEDEC 22-A104-B -65°C to 150°C, 100/300/500/1000 cycles
    HAST JEDEC 22-A118 130°C/85% RH, 33.5 PSI 48/96 hrs
    HTST JEDEC 22-A103-B 150°C, 500/1000 hrs
    THT JEDEC 22-A101-B 85°C/85%RH 500/1000 hrs
    PCT JEDEC 22-A102 121°C/100%RH/15 psi ,96/168/300 hours
    Thermal shock test JEDEC JESD22-A106 -65ºC~150ºC, 100 / 300 / 500 cycles