• English
  • Products
  • Overview

    Low profile and thin quad flat packages (QFP) are classified by the overall thickness (t)
    according to JEDEC definition:

    ‧L type: 1.2< t <=1.7 mm
    ‧T type: 1< t <=1.2 mm

    Low profile and thin QFPs are becoming popular, as they are ideal for the applications in lightweight and portable electronic products. ASE offers the lead count of LQFP/TQFP ranging from 32 to 256 and 44 to 176 respectively, covering almost all the applications in memory, DSP, and communication ICs. Due to the low electrical parasitic out of the small outline and shorter leads, low and thin QFPs are suitable for RFICs, and a cost-effective alternative to expensive ceramic QFPs.

    Exposed Pad L(T)QFP
    The exposed pad can be soldered to the PCB so that the heat can be driven off directly (the JA is only half as much as the standard L(T)QFP). Besides, this pad is also electrically grounded, and thus results in far smaller ground inductance. Exposed pad L(T)QFP is a cost-effective solution suitable for enhancing thermal and electrical performance.

    Application

    Telecommunication products
    Cellular phones
    Wireless LAN

    Portable products
    Personal computer
    Personal digital assistants
    Digital camera

    Medium lead count packages
    Information appliances

    LQFP / TQFP
    LQFPs are ideal package for lightweight and portable electronic products requiring broad performance characteristics. The low electrical parasitic out of the small outline and shorter leads makes LQFP suitable for RFICs. Other LQFP applications include lap-top PCs, memory, video ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets, telecom, office equipment, disc drives and communication boards.

    EP-TQFP
    Exposed Pad TQFP provides better thermal performance which gives IC designers the needed margin for high performance products. Common application of Exposed Pad TQFP packages are telecommunication, wireless, pagers, disk drives and RF modules.

    Features

    LQFP/EP-LQFP Packing Offering
    7 x 7 mm to 28 x 28 mm body size available
    Wide selection of pad size to meet die requirements
    Customize leadframe design capability
    32 ~ 256 leads counts available
    Fine Pitch wirebond capability
    Lead free process ready and available
    High conductivity Copper leadframes
    Low stress die attach materials
    Power enhancement version
    JEDEC standard compliant
    TQFP/EP-TQFP Packing Offering
    10 x 10 mm to 20 x 20 mm body size available
    Wide selection of pad size to meet die requirements
    Customize leadframe design capability
    44 ~ 176 leads counts available
    Fine Pitch wirebond capability
    Lead free process ready and available
    High conductivity Copper leadframes
    Low stress die attach materials
    Power enhancement version
    JEDEC standard compliant

    Reliability

    Package Level
    Test Item Reference Standard Condition/Duration
    MSL JEDEC 22-A103 Level 3, 30°C/60% RH, 192 hrs
    TCT JEDEC 22-A104-B -65°C to 150°C, 500/1000 cycles
    HAST JEDEC 22-A118 130°C/85% RH, 33.5 PSI 48/96 hrs
    HTST JEDEC 22-A103-B 150°C, 500/1000 hrs
    THT JEDEC 22-A101-B 85°C/85%RH 500/1000 hrs
    PCT JEDEC 22-A102 121°C/100%RH/15 psi ,96/168 hours
    Board Level (Contact ASE for further details.)