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  • Overview

    Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has an overall thickness of over 1.7mm.

    Application

    ASE PBGA's design and features improve the performance of graphics, PLDs, DSPs, PC chipsets, communications, networking, microprocessors/controllers, ASIC, gate arrays and memory packages.

    Features

    BGA is suitable for high power and high speed ICs requiring superb electrical and thermal enhancement.
    15x15 mm to 45x45 mm package
    119 balls to 1520 ball count
    High interconnect density
    Low assembly cost
    Self-alignment during reflow
    Low profile
    Ease of thermal and electrical management
    Ease of routing
    Good power dissipation
    JEDEC MS-034 standard outlines
    Lead free process available
    Full In-house design capability

    Reliability

    Package Level
    Test Item Reference Standard Condition/Duration
    MSL JEDEC 22-A103 Level 3, 30°C/60% RH, 192 hrs
    TCT JEDEC 22-A104-B -65°C to 150°C, 500, 1000 cycles
    HAST JEDEC 22-A118 130°C/85% RH, 33.5 psi 96 hrs
    HTST JEDEC 22-A103-B 150°C, 500/1000 hrs