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  • Overview

    Heat slug BGA (HSBGA) is an upgraded type of PBGA. Within the molding area, a piece of copper heat slug is implanted. The heat slug is intended to lower the thermal resistance (θJA) of PBGA without change of material. The θJA of HSBGA is generally 20% lower than PBGA and achieves 5 to 6W of thermal dissipation under natural convection. This technology can be applied to any kind of die-up substrates (e.g. 2- or 4-layer BT, and metal core). HSBGA is an excellent solution for cost-effective high power package, high-speed ICs like graphics chips, communication and networking ICs.

    Application

    HSBGA is excellent for products that require improved thermal performance such as high power packages for high speed ICs in personal computers, networking and graphic ICs, data communication, consumer ICs and in telecommunication applications.

    Features

    HSBGA is suitable for high power and high speed ICs requiring superb electrical and thermal enhancement.

    15x15 mm to 45x45 mm package available
    120 balls to 1520 ball count available
    Cost effective
    Good electrical performance
    Good thermal performance
    Good power dissipation
    JEDEC MS-034 standard outlines
    Lead free process ready and available
    Full In-house design capability
    Full electrical and thermal characterization capability

    Reliability

    Package Level
    Test item Reference Standard Condition/Duration
    MSL JEDEC22-A103 Level 3, 30°C/60% RH, 192 hrs
    TCT JEDEC 22-A104-B -65°C to 150°C, 1000 cycles
    HAST JEDEC 22-A118 130°C/85% RH, 33.5 psi 96 hrs
    HTST JEDEC 22-A103-B 150°C, 1000 hrs