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  • Overview

    Pin Grid Array (PGA) is a microchip design that has the silicon core of the microchip facing down toward the motherboard. The core is covered by a heat slug, which helps to dissipate the heat to the heatsink better. As IC technology becomes faster, more complex and more powerful, the demands for high-performance packaging increases. The thermal, mechanical and electrical performance of the package should match the requirement of the device. PGA, with its excellent thermal, mechanical and electrical performance, can meet the high performance requirements.

    Application

    PGA is suitable for highly demanding/high-performance microprocessors.

    Features


    Excellent thermal performance
    Excellent electrical performance
    High mechanical strength
    Excellent high frequency insulation
    No water absorption

    Reliability Test Plan

    Package Level of Regular BOM
    Test Item Reference Standard Condition/Duration
    TCT -40ºC~150ºC 1000 cycles (MIL STD-883)
    TST -65ºC~150ºC 1000 cycles (MIL-STD-883)