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    QFN
    Based on copper lead frame, Quad Flat No-lead (QFN) or microchip carrier uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire with the PCB. QFN packages are suitable for applications over 12GHz working frequency. Providing both thermal and electrical enhancement, QFN is a cost-effective packaging solution due to its economical materials and simpler packaging process.

    Application

    Telecommunication products
    Cellular phones
    Wireless LAN

    Portable products
    Personal digital assistants
    Digital cameras

    Low to medium lead count packages
    Information appliances

    Features

    Small footprint
    Low profile (< 0.9 0.2 L/F + 0.65 Mold)
    Light weight
    Cost effective
    Better electrical performance
    Better power dissipation

    Reliability

    Package Level
    MSL JEDEC 22-A113 JEDEC Level 2Aa 60°C/60%120 hours for PPF lead frame
    JDEEC Level 2Aa 60°C/60%120 hours for Cu lead frame
    PCT JEDEC 22-A102 121°C/100%/2 atm 100 hours
    TCT JEDEC 22-A104 65~150°C 1000 cycles
    HAST JEDEC 22-A118 130°C/85% RH 100 hours
    HTST JEDEC 22-A103 150°C 1000 hours
    THT JEDEC 22-A101 85°C/85% RH 1000 hours