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  • Overview

    Land grid array (LGA) uses laminate substrate to form the landing pad and the exposed pad for performance enhancement. It is essentially a BGA minus the solder balls. LGA’s advantage over other leadless packages are its flexible routing and multi-chip module capability. LGA is also a thinner (down to 0.5 mm) and lighter CSP. LGA technology has been developed for lead free solution and spacing reduction on mother boards. This type of package has chip size solution based on mature laminated substrate technology and material.


    LGA is suitable for high performance ICs like Single Chip, CPU, Logic and Memory. Common applications for this type of package includes:

    Telecommunication products
    Cellular phone-RF Devices
    Wireless LAN

    Portable products
    Personal digital assistants
    Digital camera
    IC recorders
    MP3 players

    Memory card
    SD card
    MS card


    Thinner, lighter and smaller Chip-Scale Package
    Mature standard matrix BGA assembly process
    ‧Higher yield/quality
    ‧Higher though-put
    ‧Lower cost
    Space reduction in system level
    Pb free solution
    Excellent electrical and thermal performance


    Package Level
    Test Item Reference Standard Condition/Duration
    MSL JEDEC22-A103 Level 3, 30°C/60% RH, 192 hrs
    TCT JEDEC 22-A104-B -65°C to 150°C, 1000 cycles
    HAST JEDEC 22-A118 130°C/85% RH, 33.5 psi 96 hrs
    HTST JEDEC 22-A103-B 150°C, 1000 hrs