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  • Overview

    The need for high density, high performance, and cost effectiveness has helped speed the development of System-on-a-Chip (SoC) and System in a Package (SiP). The most current assembly technology is the Multi-Chip Module (MCM) package. It integrates different functions of chips such as microprocessors, memory, logic, optic ICs and capacitors, onto mini-substrates, instead of placing individual packages onto a large PCB (also known as second level package).

    Application

    ASE’s MPBGA (Multi Package Ball Grid Array) utilizes the MCM assembly method. It employs the latest IC packaging technology for high-density products. The electrical and thermal performance and the affordability of the MPBGA package enables system designers to integrate several devices (Known Good Die) onto a single IC package. ASE has been in volume production since Q1, 2002.

    The integration of several semiconductor technologies onto a single MPBGA package offers excellent advantages for many applications where size, weight, electrical performance, and board density are critical requirements. The high-speed performance and improved thermal capability of the MPBGA package are also excellent for personal computing, networking, graphic chip, data communication, consumer IC, telecommunication, analog/digital, ASIC, and memory applications.

    Features


    Known good die
    Reduced size and weight
    Improved Silicon efficiency
    Reduced signal delay & noise
    Lower power consumption
    Enhanced speed & bandwidth
    Excellent electrical performance by shrinking the board level interconnection into a package level
    Customized-design of substrate routing
    Space saving
    System integration

    Reliability

    Package Level
    MPBGA (31x31 PBGA+12x12 CSP)
    MSL JEDEC level 3 30°C/60%, 192 hours, IRx3, 220C
    HAST 130°C/85% RH, 33.5 PSI, 50/100, hrs
    TCT -65°C~150°C, 1000 cycles
    HTST 150°C 1000 hours
    THT 85°C/85%, 100 hours
    Lead Free Capability (Q3/2002 ready)
    MSL JEDEC level 3 30°C/60%, 192 hours, IRx3, 260C
    HAST 130°C/85% RH, 33.5 PSI, 50/100, hrs
    TCT -55°C~125°C, 1000 cycles
    HTST 150°C 1000 hours
    THT 85°C/85% 1000 hours
    Board Level
    MPBGA (35x35 PBGA+12x12 CSP)
    Temp cycle -40°C~125 No failure 702 cycles (W/O under fill)
    Temp cycle 40°C~125 No failure 1300 cycles (W/O under fill)
    Bending 1mm deflection/1Hz 63.2% failed 272200 cycles (W/O under fill)
    Drop 1m Height 100 drops no failed between CSP