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  • Overview

    Side by side MCM PBGA and side by side MCM HSBGA are the types of MCMs offered by ASE. MCM HSBGA includes multi heat slug for heat dissipation in different die layout (square, trapezoid and eclipse).

    Application

    PC
    Chipset
    Graphics and Memory

    Consumer
    Game console
    Set top box

    Communication
    PDA
    Bluetooth modules

    Features

    23x23 mm to 45x45 mm body size
    Full in-house design capability
    Fine Pitch wirebond capability
    Lead free process available
    High speed performance
    Good thermal performance
    Different devices integrated onto one package
    Cost effective solution for high density package
    Eliminate the use of second level package
    Good electrical performance
    JEDEC standard compliant

    Reliability

    Package Level
    MSL JEDEC Level 3, 30°C/ 60% RH 192 hours
    PCT 121°C/ 100% RH/ 2 atm 168 hours
    TCT –65°C ~ 150°C 1000 cycles
    HAST 130°C/ 85% RH 96 hours
    HTST 150°C 1000 cycles
    Board Level
    TCT -40°C~125°C 3500 cycles no failure
    THT 85°C/85% RH 1000 hours no failed
    Vibration test 4 times of vibration for eash axis No failed