• English
  • Products

  • Overview

    Stacked leadframe with same features as QFP/LQFP/TQFP is available now, with multi-chip structures.

    Total thickness is according to JEDEC definition. They are ideal for applications in lightweight and portable electronic products.

    Depending on lead counts, die counts and thickness requirements, this works with almost all applications in memory, DSP, and communication ICs. Due to the low electrical parasitic out of the small outline and shorter leads, low and thin QFPs are suitable for RFICs, and a cost-effective alternative to expensive ceramic QFPs.

    Application

    Telecommunication products
    Cellular phone
    Wireless LAN

    Portable products
    Personal computer
    Personal digital assistants
    Digital camera

    Medium lead count packages
    Information appliances

    LQFP / TQFP
    LQFPs are ideal package for lightweight and portable electronic products requiring broad performance characteristics. The low electrical parasitic out of the small outline and shorter leads makes LQFP suitable for RFICs. Other LQFP applications include lap-top PCs, memory, video ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets, telecom, office equipment, disc drives and communication boards.

    EP-TQFP
    Exposed Pad TQFP provides better thermal performance which gives IC designers the needed margin for high performance products. Common application of Exposed Pad TQFP packages are telecommunication, wireless, pagers, disk drives and RF modules.

    Features

    Stacked QFP/LQFP/TQFP Package Offering:
    (Please refer to QFP/LQFP/TQFP in details.)
    7 x 7 ~28 x 28 mm body size available
    Wide selection of pad size to meet die requirements
    Customize leadframe design capability
    32 ~ 256 leads counts available
    Fine Pitch wirebond capability
    Lead free process ready and available
    High conductivity Copper leadframes
    Low stress die attach materials
    Power enhancement version

    Reliability

    Package Level
    MSL JEDEC 22-A113 JEDEC Level 3 30°C/60%RH/192hours
    PCT JEDEC 22-A102 121°C/100%RH/15 psig, 300 hours
    TCT JEDEC 22-A104 65~150°C 1000 cycles
    HAST JEDEC 22-A118 130°C/85% RH 96hours
    HTST JEDEC 22-A103 150°C 1000 hours
    THT JEDEC 22-A101 85°C/85% RH 1000 hours
    Board Level (Contact ASE for further details.)