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    ASE offers stacked Ball Grid Allay package that combines BGA package solutions onto MCM type. Stacked BGAs are also one of the most SiP popular package solutions for flash & SRAM combination.

    For more information on how SiP Stacked BGA can solve your packaging problems. Contact your local ASE office for further information.


    The integration of several semiconductor technologies into single MCM BGA package offers excellent advantages for many applications where size, weight, electrical performance and board density are important considerations.


    23x23 mm to 45x45 mm body size available
    Full in-house design capability
    Fine Pitch wirebond capability
    Pb free process available
    High speed performance
    Good thermal performance
    Different devices integrated onto one package
    Cost effective solution for high density package
    Eliminate the use of second level package
    Good electrical performance
    JEDEC standard compliant


    Package Level
    Test Item Reference Standard Condition/Duration
    MSL JEDEC 22-A103 Level 3, 30°C/60% RH, 192 hrs
    TCT JEDEC 22-A104-B -65°C to 150°C, 1000 cycles
    HAST JEDEC 22-A118 130°C/85% RH, 33.5 psi 96 hrs
    HTST JEDEC 22-A103-B 150°C, 1000 hrs