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  • Overview

    Hybrid (F/C + W/B) is a package technology stacking one die on the top of probed good die to integrate an ASIC and memories such as flash, SRAM and DDR into one package, interconnecting them with wire bonding and molding. Hybrid packages deliver increased functionality and performance. Besides, they offer procurement flexibility, lowest packaging cost compared to individually package die and faster time to market. Normally designers use Hybrid package for wireless applications such as cell phones and consumer products like camcorders, digital camera and PDA etc.

    Currently, the major concern to the packaging is KGD issue (Known good die). One bad die will ruin the entire module. Also, the rework is not an option. Therefore, probed good die is important before integration.

    Application

    Applications of Hybrid package include analog devices, ASIC, Baseband, Processor, integrated passives, and RF devices.

    Consumers
    Camcorders
    Digital Camera
    Digital Home
    DVD

    Communication
    Smart phone
    Blue tooth
    PDA

    Compute
    WiMAX
    WLAN
    Notebook

    Car
    GPS
    Automotive

    Features

    Package size 7x7 mm to 14x14mm available
    Fine Pitch wire bond capability
    Green process available
    Smaller, Thinner and Lighter Packages
    Cost effective solution for high density package
    Higher performance structure for molding type
    Easy rework or change on board level process
    Stacked die solution
    JEDEC standard compliant