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  • Overview

    Flip Chip Organic BGA
    Laminate or build-up organic substrate offers better electrical performance than wire-bond type BGA package especially in high frequency applications.

    Flip Chip Ceramic BGA
    Alumina ceramic substrate offers better moisture resistance, electrical insulating property and higher thermal conductivity than organic substrate. FCBGA is used primarily for high-reliability commercial applications (e.g. CPU).

    Application

    Computer
    Graphics/chipsets for PC
    Server
    Game console and High-end application
    Microprocessor for PC & Server
    memory

    Telecommunications
    Network products (LAN)
    Switching
    Transmission
    Cellular Base Stations

    Features

    Substrate 4 layer laminate, 4~12 layer & 800 / 400 um Build-up substrates, and ceramic substrates are available for different application
    Passive Component Passive component attaching is available. It can be placed on the top or bottom side of the package
    Ceramic BGA High Pb solder ball with eutectic solder paste improves board level reliability performance of ceramic packages

    Reliability

    Package Level
    MSL Level 4 220 °C
    TCT-B 1000 cycles
    THT 1000 hrs
    HTST 1000 hrs
    PCT 96 hrs (For Reference Only)
    HAST 100 hrs
    Board Level (Contact ASE for further details.)