ASE's substrate design and manufacturing capability enables the interconnection materials of a wide range of wire-bond BGA and flip chip product applications. We also provide stub-less solution with etching back and GPP process for substrates for high frequency and high performance package applications.
We believe that interconnect technology and materials have become an increasingly value-added element for the semiconductor packaging business. Consequently, ASE continues to focus on developing and enhancing the in-house capability and capacity of substrate design and manufacturing to benefit our customers with our fast cycle time, largest capacity, mature technology and competitive price.
|Package Types||PBGA||LFBGA||TF/VF/WFBGA||FCBGA Build-up||FCBGA Laminate & CSP|
|Package Dimension (mm)||14x12~45x45||6x6~23x23||5x5~27x15||50x50 (Max.)||1.0x1.5~18x18|
|I/O Count||119~1600L||64~484L||36~364L||1681L (Max.)||520L (Max.)|
|Ball Pitch (mm)
|No. of Layers||2, 4 & 6||2 & 4||2 & 4||1+N+1~3+N+3||2~4|
Graphic Card/ Network Communication
|Wireless Communication/ Portable Electronics|