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  • Characterization Services

    The Complete Technical Services Provider
    ASE provides superior technical analysis and consulting services to improve the IC packaging development process and to allow circuit designers the maximum flexibility in their designs.

    Characterization Labs

    Since 1995, the ASE characterization labs have incorporated sophisticated instruments to provide both physical and chemical evaluation on packaging related issues. The labs are involved in the electrical, material, stress-reliability and thermal fields.

    Characterization Services

    Electrical Characterization
    The ASE Electrical Laboratory is dedicated to providing IC package electrical characteristics design and analysis in terms of simulation and measurement techniques. ASE also works closely with customers to co-design custom IC packaging solutions. The characterization services include:

    R.L.C for Critical Traces
    R.L.C for Min/Max Traces
    IBIS Model
    SPICE Model
    Power Noise Analysis
    Ground Noise Analysis
    S-parameters Analysis
    Impedance Analysis
    Cross Talk Noise Analysis
    Noise Isolation Analysis
    Signal Integrity Analysis
    Customized Design Service

    Material Characterization
    ASE performs evaluation on material properties (physical, chemical, surface and mechanical) for new materials and optimization on material performance and process parameters for existing materials. This is done to improve reliability, reduce production cycle time, and reduce manufacturing cost without compromising product quality. The characterization services include:

    Property Characterization
    • Tg (glass-transition temperature)
    • CTE (coefficient of thermal expansion)
    • Curing kinetics
    • Modulus
    • Gel point
    • Filler content
    • Weight loss
    • Curing degree
    • Viscosity and thixotropic index
    • Organic functional group
    • Mixture composition
    • Surface roughness
    • Surface chemical composition
    • Nanoindentation
    • Solder joint shape measurement
    • Water angle

    Failure Mechanism Analysis
    • Encapsulant: Incomplete fill / Wire sweep / Warpage / Delamination / Void
    • Silver epoxy: Outgassing / Delamination / Void / Bleed
    • Substrates: Warpage / Contamination / Crack
    • Flux: Flux residue / Outgassing / Corrosion
    • Leadframe: Contamination / Moisture uptake
    • Underfill: Delamination / Viod
    • Electromigration Test  

    Stress-Reliability Characterization
    Stress and reliability characterization is used to analyze stress issues and package reliability by numerical simulation and measurement. The analysis includes root cause investigation into packaging failure such as die crack, delamination, and optimal design for low stress and high reliability. Characterization also provides component and system-level stress analyses to predict the fatigue life of solder joints, like temperature-cycling-test (TCT), drop test, bending test, and other reliability tests. The characterization services include:

    Thermal Stress Characterization
    Warpage & component stress prediction
    Warpage & component stress measurement
    Packaging material selection & structure design
    Material mechanical properties measurement and test
    Package level reliability analysis
    Die strength flexural test
    Die pull test to evaluate UBM/Bump structural integrity

    Process Simulation
    Die-boding process dynamic simulation
    Solder bump / joint shape prediction

    Board Level Reliability Test and Simulation
    Temperature cycling test
    Cyclic bend test
    Drop / shock test
    Failure analysis
    Solder joint reliability (fatigue) prediction
    Wire-bonding process dynamic simulation
    Vibration Test
    Ball Impact Test

    Thermal Characterization
    As the size of a chip shrinks, heat is concentrated within a smaller area and can result in high heat flux density. In addition, numerous and denser transistors placed in a monolithic chip, and the use of MCM is liable to decrease the power dissipation in IC packaging. Dissipating the heat effectively from the chip is a major challenge for engineers. ASE provides services to conduct component-level and system-level thermal analyses. Both simulation and measurement techniques are available. The characterization services include:

    Thermal Parameters
    θJA (junction-to-ambient)
    θJC (junction-to-case)
    θJB (junction-to-board)
    ΨJT (junction-to-top)
    Thermal optimal design for packages
    External heat sink effect evaluations
    Hot spot impact predictions
    Compact Thermal Models (CTMs) offering
    Transient analyses for power pulse impacts
    Simulations for burn-in/HTOL tests
    Assessments for impact of temperature-dependent leakage power

    Chemical Lab Characterization
    Green Product Analysis
    Analyze 20 controlled substances in green products. Offer prompt and accurate service to customers.

    Bumping and Substrate Plating Solution Analysis
    Analyze production-in-process plating solution and in-coming chemicals.

    Establishing QC System for Bumping and Substrate
    Combine chemical analysis and SPC to obtain material/ process optimization to reduce production cost and promote product quality.

    Green Products Analysis
    • Cr+6 (Hexavalent – Chromium)
    • Pb (Lead) / Cd (Cadmium) / Hg (Mecury)
    • Sb oxide F.R.
    • Mirex (Perchlordecone)
    • Azo compound
    • Formaldehyde
    • Organic tin compounds (Tributyl tin compound /Triphenyl tin compound /TBTO)
    • PBB (Poly brominated biphenyls )
    • PBDE (Poly brominated diphenyiethers )
    • TBBPA-A-bis (Tetrabromobisphenol- A bis- (2,3-dibromopropylether)
    • PCB (Polychlorinated biphenyls)
    • PCN (Polychlorinated naphthalenes)
    • CP (Short-Chain chlorinated paraffins)
    • PCT (Polychlorinated terphenyls)
    • Red Phosphorus
    • Halogenated F.R. (F, Cl, Br, I)
    • Asbestos
    • PVC (Polyvinyl chloride)

    Bumping / Substrate (Process Control) Analysis
    Heavy metal / Purity / Impurity / contain

    Characterization Labs

    Electrical Lab
    Ansoft 2D Extractor
    Ansoft Q3D Extractor
    Ansoft TPA
    Ansoft HFSS
    Ansoft SIwave
    Cadence APSI
    Agilent ADS
    TDA IConnect system
    Sigrity Speed2000
    Sigrity PowerSI/Broadband spice
    Agilent 8722ES VNA
    Agilent 8364B PNA
    Agilent 4291B RF Impedance Analyzer
    Tektronix TDS8000 DSO
    Agilent 70843C Pattern Generator
    Agilent 83752A Synthesized Sweeper
    Gigatest GTL-4040 Probing Station
    Double Sided Probing Station
    High frequency Cables and Probes

    Material Lab
    AES (Auger Electron Spectroscopy)
    ESCA (Electron Spectroscopy for Chemical Analysis)
    AFM (Atomic Force Microscopy)
    APA (Advanced Polymer)
    DMA (Dynamic Mechanical Analyzer)
    FTIR (Fourier Transform Infrared Spectrometer)
    TGA (Thermal Gravimetric Analyzer)
    TMA (Thermal-mechanical Analyzer)
    Contact Angle Analyzer
    SMT Microscope

    Thermal Lab
    Wind Tunnel
    Enclosure box
    Theta jc measurement fixture
    Theta jb measurement fixture
    DAS (Data Acquisition System)
    Calibration System
    Hot disk

    Stress-Reliability Lab
    Micro-force Tester
    Shadow Moiré
    High speed shear tester
    UTM (Universal Testing Machine)
    Low/High Power Optical Microscope
    Temperature Cyclic Chamber
    Drop/ Shock tester
    Vibration Shaker
    Surface Evolver
    Mold Flow
    JEDEC Drop Tower
    Vibration Tester
    Ball Impact Tester

    Chemical Lab
    UV-Vis (Ultraviolet Visible Absorption Spectroscopy)
    ICP-OES (Inductively Coupled Plasma)
    GC-MS/FID (Gas Chromatography/Mass Spectrometer)
    GC/FPD (Gas Chromatography)
    GC/MS (Gas Chromatography/Mass Spectrometer)
    GCMSD+ECD (Gas Chromatography/Mass Spectrometer)
    GCMSD+PY (Gas Chromatography/Mass Spectrometer)
    IC (Ion Chromatography)
    FTIR (Fourier Transform Infrared Spectrometer)
    XRF (Fluorescent X-ray Analyzer)
    TOC (Total Organic Carbon)
    CVS (Cyclic Voltammetric Stripping)
    Auto titration
    EA (Elemental analysers)
    Karl fisher
    Particle particle counter