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SiP Module

Product Overview

The system-in-package (SiP) module market has grown significantly over the past several years and it is now one of the fastest growing packaging technologies in the semiconductor industry driven by lower cost, smaller form factor, higher levels of integration and better performance. SiP modules are highly adopted by end customers for wireless communication applications including the RF sections of mobile phone and wireless connectivity. ASE Group, who is already the leader in SiP module manufacturing in terms of experience, technology and capacity, is committed to provide extra value to customers by providing turnkey SiP module total solution.

Applications

Power Amplifiers
Transceiver
Front-end module
Antenna switch module
Bluetooth
WLAN(802.11 a/b/g)
GPS/AGPS
Mobile-TV (DVB-T/H, DMB, ISBD-T)
WiMax (802.16e)

Features

Low profile, small footprint and light weight
Free-form I/O design
Fine lead pitch 0.4mm
Excellent thermal performance
Excellent electrical performance
Good SMT performance
Cost effective package
Extend QFN I/O count up to 400