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aQFN™

Product Overview

Advanced Quad Flat No-lead. aQFN™ is solution for leadless, multi-row and fine pitch lead frame packages with enhanced Thermal/ Electrical performance. aQFN™ is a cost-effective packaging solution due to its economical materials and simpler packaging process.

Applications

Telecommunications products
Cellular phones
Wireless LAN

Portable products
Personal digital assistants
Digital cameras

Low to medium lead count packages
Information applications

Features

Low profile, small footprint and light weight
Free-form I/O design
Fine lead pitch 0.4mm
Excellent thermal performance
Excellent electrical performance
Good SMT performance
Cost effective package
Extend QFN I/O count up to 400