ASE Technology Named Industry Leader in the 2018 Dow Jones Sustainability Indices
The company is recognized for a third year in a row on the iconic annual global sustainability performance index
Taipei, Taiwan, September 13, 2018 - ASE Technology Holding Co Limited (ASE, TAIEX: 3711, NYSE: ASX), the leading provider of semiconductor packaging, test and system assembly services, today announced that it has been included in the 2018 Dow Jones Sustainability Indices (DJSI) World and Emerging Market segments. This will also be the third year in a row that the company has been selected as the Industry leader in the Semiconductors and Semiconductor Equipment Industry Group. Its predecessor, Advanced Semiconductor Engineering Inc was selected 2016 and 2017 industry leader respectively.
ASE was among 2,500 largest companies of the S&P Global Broad Market Index selected in the annual DJSI World assessment. Additionally, out of 55 companies assessed in the Semiconductors and Semiconductor Industry segment, only 6 of the companies including ASE made the cut on the DJSI World list.
“It is truly an honor to be included on the DJSI annual list in an industry that is so highly competitive,” said Jason Chang, Chairman of ASE Technology. “Going forward, we will continue our sustainability efforts through pragmatic, honest and responsible practices that will create positive impacts on the industry and society,” he continued.
Launched in 1999, the DJSI were the first global indices tracking the financial performance of leading sustainability-driven companies worldwide based on RobecoSAM's analysis of financially material Environmental, Social, and Governance (ESG) factors and S&P DJI's robust index methodology. For more information, please visit https://www.robecosam.com/csa/csa-resources/industry-leaders.html.
About ASE Technology Holding Co Limited
ASE Technology Holding Co Limited is among the leading providers of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, ASE develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services. For more information about ASE Technology, visit www.aseglobal.com.