ASE K18B Groundbreaking Ceremony: Strengthening Our Competitiveness in Advanced Packaging

KAOHSIUNG, Taiwan, Oct 03, 2025 – Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holdings Inc, NYSE: ASX, TWSE: 3711) held a groundbreaking ceremony today for its K18B factory in Kaohsiung, Taiwan. This new facility is designed to support the rapidly growing demand for artificial intelligence (AI), automotive electronics, and high-performance computing (HPC). The K18B factory is set to further strengthen ASE’s competitive position in the advanced packaging sector while driving innovation and economic growth in Taiwan.

Scheduled for completion in the first quarter of 2028 with an investment of NT$17.6 billion, the factory will create nearly 20,000 new jobs focused on advanced packaging processes (CoWoS) and system-in-packaging. This includes Copper Pillar Bumping, FOCoS, and FC BGA for CoWoS and Chiplets, providing efficient and reliable solutions to customers.

The K18B factory features a VC-B grade anti-vibration design and includes an independent Central Utility Building (CUB) for centralized management of electricity, cooling water, and compressed air systems. It also incorporates an intelligent fire evacuation guidance system and an AIoT fire safety inspection system to improve operational safety. In line with ASE’s commitment to sustainability, the new factory will use low-carbon building materials, smart energy management, and recycled water systems, aiming for EEWH Gold certification and a Fire Material Label to establish a low-carbon, eco-friendly smart factory.

“As advanced packaging becomes increasingly vital in the semiconductor value chain, ASE will continue to invest in cutting-edge technologies and equipment to meet the rising global demand for AI and HPC,” said Dr. Mike Hung, Senior Vice President of ASE Kaohsiung. “The establishment of the K18B factory will not only drive local industrial growth but also further strengthen ASE’s strategic position within the global semiconductor supply chain,” he continued.

As a global leader in semiconductor packaging and testing, ASE continues to push the boundaries of innovation with its advanced packaging technology. The investment marks a pivotal step in ASE’s pursuit of a dual transformation of “advanced × sustainable” –reinforcing its vision to shape a smarter, greener and more resilient semiconductor ecosystem. Through close collaboration with partners in Taiwan and globally, ASE is paving the next generation of sustainable and transformative semiconductor solutions.