Industry-Academia Collaborations

Rapid advancements in technology and the increased in demand for skilled professionals have greatly intensified the war for talent in the semiconductor industry. To support the growth momentum of the industry, ASEH has established long-term industry-academia collaborations with colleges and universities to develop future talent. We seek to address the talent shortage in the industry by providing students with an early understanding of industrial needs and advanced semiconductor technology development, as well as connecting knowledge acquired in the classroom with practical industrial applications. Industry-academic collaboration enables us to offer a range of industry-specific courses, academic programs, and internship opportunities that strengthen the bridge between academia and the industry, powering an energetic pool of semiconductor talent for a winning future.

ASEH has created key programs like "academia cooperation and corporate internship", "academic research collaboration", and "scholarships" to leverage on the expertise from these academic resources. In 2024, ASEH continued its collaborations with local schools, contributing over US$7 million, including US$1.1 million towards 65 innovative industry-academia collaboration projects and US$0.8 million for scholarships. We also recruited 686 interns and enrolled 615 students in the semiconductor courses. Nearly 100 schools and research institutions in Taiwan, China, Singapore, Malaysia, South Korea, Japan, etc. were involved in these collaborations.

ASE Kaohsiung is actively responding to the evolving needs and future trends of the semiconductor industry with a strong focus on industrial transformation and advanced packaging technologies. Since 2015, the company has embarked on automation research through industry-academia collaborations, with a total of 56 joint projects to date. In parallel, ASE has been continuously conducting research and development with universities in packaging technologies, deepening the company’s interdisciplinary collaboration with academia, and driving progress in smart manufacturing. We are making great strides in cultivating sustainable talent and contributing to a greener future.

• Achievements in Automation Research

  In collaboration with National Sun Yat-sen University, National University of Kaohsiung, and National Kaohsiung University of Science and Technology, ASE initiated seven projects in 2024. The collaboration includes the development of a graphic chart to detect emerging public opinion and issues; the creation of a dashboard for geopolitical and customer-related risk monitoring that enables real-time insights and faster decision-making; an AI application in cybersecurity that analyzes file access behavior and enhances defense capabilities; the use of smart manufacturing systems to identify high-risk combinations and key parameters, improving yield and anomaly detection; implementation of digital twin technology for energy monitoring in oven equipment, enhancing energy management decisions; integration of data quality checks and data lineage analysis to trace data origins and optimize the data infrastructure for effective crisis response. ASE is also advancing its Industrial AI (IAI) roadmap, having developed a No Code IAI 3.0 platform and trained over 10,000 individuals. This aligns with its “Everyday AI” strategy and earned ASE the TAIA (Taiwan AI Association) AI Award for Best Speaker in 2024. We are continuing to explore new methods to drive smart technology and create a better, technology-driven future.

• Achievements in Semiconductor Packaging Research

  In 2024, ASE hosted the 12th Annual Packaging Technology Symposium in collaboration with National Sun Yat-sen University, National Chung Cheng University, National Cheng Kung University, and National Kaohsiung University of Science and Technology. 19 research projects were presented at the symposium. These research projects helped to integrate practical industry insights into academic settings, advancing academic knowledge and nurturing future talent.

  The research efforts centered on two primary themes: advanced packaging and optical module applications, and the development and improvement of packaging test processes. Notable achievements included the optimization of near-infrared filter materials using AI and big data analytics, as well as the development of multi-layer nano-coating technologies for ambient light sensors. Additionally, a predictive system for flip-chip magnetic lid design was introduced, significantly reducing design costs and improving production efficiency. In the area of environmental innovation, the team successfully developed an inorganic photoresist remover that substantially lowered chemical usage and carbon emissions. Improvements in wafer surface treatment also enhanced permeability and overall product performance. These research outcomes have been effectively implemented in ASE’s production lines, contributing to higher yield rates, greater customization capabilities, and more efficient manufacturing processes—bridging the gap between academic research and industrial application.

To continue nurturing the much needed skillset and interest in semiconductor engineering, Silicon Precision Industries Ltd. (SPIL) has been building collaborative relationships with top universities. For eleven consecutive years, SPIL has co-organized the University Corporate Mentors program with the National Chung Hsing University. The program organized activities such as; challenges in the semiconductor engineering workforce forum, production line tours, mentor-mentee dinners, forum on graduate students’ work life experiences, and the Team Silicon Adventure competition, for students to gain insights into industry dynamics and explore career interests. SPIL’s program encourage greater student participation and engagement, and directly help to attract outstanding talents and prepare students for employment. In 2024, a total of 314 students participated in the University Corporate Mentors program, accumulating 1,563 hours of participation. In addition to providing students with knowledge and opportunities in the OSAT industry, the program serves as a means for the industry to contribute to schools and society.

Employee education, training and transfer of skills rank highly at USI. To that end, the USI University was established in 2006 to provide free courses covering corporate experiences, management knowledge and the latest technology and industry trends. The USI University actively collaborates with industry and public associations, and universities and provides internally trained instructors to design the courses.

The USI University plays a vital role in preparing students for the workforce by offering a wide range of career readiness programs. These include training in Responsible Business Alliance (RBA) standards, comprehensive overviews of the semiconductor industry, career planning guidance, competitive industry analysis, and practical workshops on interview techniques and recruitment systems. Through these initiatives, students gain valuable exposure to real-world environments and the opportunity to engage directly with industry professionals, strengthening their career development. In 2024, USI University shared a total of 25 courses, with a cumulative duration of 2,855 hours, contributing to the enhancement of youth employability.

To cultivate students equipped with both practical and theoretical knowledge and integrate learning and application, USI offers industry-academia internships at multiple facilities. We recruit students from various universities for on-site internships and provide one-on-one mentorship and training. This prepares students for a smooth transition into the workplace upon graduation. In 2024, a total of 163 students participated in on-site internships. Besides internship opportunities, USI’s Taiwan facilities collaborate closely with National Taiwan University and National Taiwan University of Science and Technology on advanced research projects. These include the development of RF desensitization models for smart handheld systems and the estimation of electromagnetic interference (EMI) alongside adhesive simulation techniques for electronic components. These collaborative efforts exemplify a mutually beneficial model of industry-academia partnership, fostering innovation while equipping students with the skills and experience needed to thrive in the evolving technology landscape. In 2024, a total of 1,447 students benefited from the industry-academia internship cooperation, accumulating a total of 144,833 hours of participation.